
Ky8030 Advanced 3D Spi System for Efficient PCBA Quality Control
Overview Package Size226.00cm * 128.00cm * 188.00cm Package Gross Weight1600.000kg .lc-a-img { position: relative; width
- Overview
- Company Profile
- Specification
- Product Description
- Packaging & Shipping
- Certifications
- FAQ
Basic Info.
| Model NO. | KY8030 |
| Resolution | 10μm |
| Lighting System | 3D Shadow Free Moire Technollogy |
| Weight Capacity | 10kg |
| Magnification | 10X~50X |
| Application | Medical |
| Lighting | IR-RGB LED |
| Input Format | Gerber Data, Odb++, Mounter Job File, Allegro |
| Operator User-Friendliness | Library, Kycal |
| Min. PCB Size | 50*50mm |
| Machine Weight | 600kg-750kg |
| Supplies | 220VAC±10% 1phase, 50/60Hz, 5kgf/Cm² |
| Lane | Single Lane/Dual Lane |
| Add-on Solutions 2 | 1d & 2D Inline Barcode Reader |
| Add-on Solutions 1 | 1d & 2D Handy Barcode Reader |
| Spec. | 1000mm*1295mm*1627mm |
| Size | L/XL |
| Statistical Process Control Tool | Spc Plus, Review Station |
| Opearating System | Windows 10 IoT Enterprise Ltsc 2019 |
| Max. PCB Weight | 4kg/10kg |
| Clearance | 40mm/50mm/100mm/70mm |
| Transport Package | Wooden Box |
| Specification | 1000mm*1295mm*1627mm |
| Trademark | Koh Young |
| Origin | South Korea |
| Production Capacity | 500000 |
Packaging & Delivery
Package Size226.00cm * 128.00cm * 188.00cm Package Gross Weight1600.000kgProduct Description
Company Profile
Specification| Inspection Items | Metrology Capability | Volume, area, height, offset, bridging, shape deformity, paste offset, coplanarity | ||||
| Type of Defects | Insufficient, excessive, missing paste, bridging, shape deformity, paste offset, coplanarity | |||||
| Inspection Performance | Model | Camera | Pixel Resolution | Full Speed Inspection Speed | Min. Distance between Pads | Max. Inspection Height |
| KY8030 Nova | 9 Mpix | 15 µm | 50cm²/sec (0.35 sec/FOV) | 150 µm | 600 µm~1 mm(23.6 mils~39.3 mils) | |
| KY8030 Nova | 9 Mpix | 15 µm | 50cm²/sec (0.35 sec/FOV) | 150 µm | 600 µm~1 mm(23.6 mils~39.3 mils) | |
Send to us
